Hot-melt pressure sensitive adhesive for adhesive strips

Details Hot-melt pressure sensitive adhesive for adhesive strips Hot-melt pressure sensitive adhesive for adhesive strips

C - Chemistry, Metallurgy

09

J

C09J 123/08 (2006.01) C09J 7/00 (2006.01)

Patent

CA 2230911

The invention discloses a hot-melt pressure sensitive adhesive composition characterised in that it includes (a) at least one ethylene-vinyl acetate, ethylene-methyl acrylate or ethylene-butyl acrylate copolymer, (b) a solid tackifying resin, (c) a liquid tackifying resin, (d) an anti-oxidant and optionally (d) a fluidising agent. The invention also discloses a hot-melt pressure sensitive adhesive composition for the preparation of labels and adhesive strips, more particularly for skin-contacting adhesive strips.

La présente invention a pour objet une composition thermofusible auto-adhésive caractérisée en ce qu'elle comprend: a) au moins un copolymère éthylène- acétate de vinyle, éthylène-acrylate de méthyle ou éthylène-acrylate de butyle, b) une résine tackifiante solide, c) une résine tackifiante liquide, d) un anti-oxydant, e) et éventuellement un fluidifiant. L'invention concerne également l'utilisation de la composition thermofusible auto-adhésive pour la préparation d'étiquettes et de rubans adhésifs et plus particulièrement des rubans destinés à être en contact avec la peau.

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