Hot melt pressure sensitive adhesive which exhibits minimal...

C - Chemistry – Metallurgy – 09 – J

Patent

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Details

C09J 153/02 (2006.01) C09J 7/04 (2006.01) C09J 11/00 (2006.01) C09J 153/00 (2006.01)

Patent

CA 2306856

This invention relates to a removable grade hot melt pressure sensitive adhesive comprising from about 5 % to about 30 % by weight of the adhesive of a block copolymer having styrene endblocks and ethylene/butylene or ethylene/propylene midblocks and having a coupling efficiency of less than about 65 % and a melt index of greater than about 20 grams/10 minutes; from about 10 % to about 50 % by weight of the adhesive of at least one block copolymer having styrene endblocks and a coupling efficiency from about 65 % to about 100 %; from about 20 % to about 60 % by weight of the adhesive of a tackifying resin and from about 10 % to about 40 % by weight of the adhesive of a liquid plasticizing oil.

L'invention se rapporte à un adhésif autocollant thermofusible qui appartient à la catégorie des détachables et comprend ce qui suit: entre environ 5 % et environ 30 %, en termes de poids de l'adhésif, d'un copolymère séquencé possédant des séquences terminales de styrène et des séquences médianes d'éthylène/butylène ou d'éthylène/propylène et caractérisé par une efficacité de couplage inférieure à environ 65 % ainsi que par un indice de fusion supérieur à environ 20 grammes/10 minutes; entre environ 10 % et environ 50 %, en termes de poids de l'adhésif, d'au moins un copolymère séquencé possédant des séquences terminales de styrène et caractérisé par une efficacité de couplage comprise entre environ 65 % et environ 100 %; entre environ 20 % et environ 60 %, en termes de poids de l'adhésif, d'une résine collante et; entre environ 10 % et environ 40 %, en termes de poids de l'adhésif, d'une huile plastifiante liquide.

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