Hot melt thermoplastic elastomeric block copolymer adhesive

C - Chemistry – Metallurgy – 08 – L

Patent

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Details

400/1817, 400/30

C08L 53/02 (2006.01) C08L 93/04 (2006.01) C09J 7/02 (2006.01) C09J 7/04 (2006.01) C09J 153/02 (2006.01)

Patent

CA 1133159

A B S T R A C T The service temperature of hot melt adhesive composi- tions containing a partially hydrogenated thermoplastic elastomeric block copolymer, a tackifying resin and a mineral hydrocarbon oil is increased by the presence of a low molecular weight polyphenylene ether resin having a viscosity average molecular weight (Mvis) of between 6,000 and 25,000 and a softening point (Tg) of between 170°C and 210°C. The improved compositions are preferably used in the preparation of pressure-sensitive adhesive tapes which are used where high service temperatures are required, for example, in paint shops where service temperatures of 110-120°C are desired.

310106

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