Hotmelt adhesive with improved adhesion

Details Hotmelt adhesive with improved adhesion Hotmelt adhesive with improved adhesion

C - Chemistry, Metallurgy

09

J

C09J 123/00 (2006.01)

Patent

CA 2666736

The invention relates to a hotmelt adhesive based on at least one ethylene and/or propylene/C4 to C20 .alpha.-olefin copolymer obtainable by metallocene-catalysed polymerization, on at least one tackifying resin, and on at least 0.1% to 15% by weight of a copolymer or terpolymer based on C2 to C5 olefins with (meth)acrylic esters of low molecular mass alkanols, the copolymer containing COOH groups or anhydride groups, and also, if desired, on wax and additives, and to its use for bonding finished substrate surfaces.

L'invention concerne un adhésif thermofusible à base d'au moins un copolymère éthylène et/ou propylène/.alpha.-oléfine en C4 à C20, pouvant être obtenu par polymérisation catalysée par métallocène, au moins une résine adhésive, ainsi qu'au moins 0,1 à 15 % en poids d'un co- ou terpolymère à base d'oléfines en C2 à C5 avec des esters d'acide (méth)acrylique d'alcanols de faible poids moléculaire. Selon l'invention, le copolymère contient des groupements COOH ou des groupements anhydride, ainsi qu'éventuellement des cires et des additifs. L'invention concerne également l'utilisation de l'adhésif pour le collage de surfaces améliorées de substrats.

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