Hotmelt adhesives

C - Chemistry – Metallurgy – 09 – J

Patent

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Details

C09J 153/00 (2006.01) C09J 131/04 (2006.01) C09J 193/04 (2006.01)

Patent

CA 2678329

New hotmelt adhesives are provided that are based on specific ethylene-vinyl acetate copolymers, styrene block copolymers, and a tackifying resin. These hotmelt adhesives are outstandingly suitable for bonding substrates, more particularly for bonding films to substrates.

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