Hotmelt adhesives based on polyamides

C - Chemistry – Metallurgy – 08 – G

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C08G 69/34 (2006.01) C09J 177/08 (2006.01)

Patent

CA 2356208

Hotmelt adhesive compositions based on crude polymeric fatty acids, optionally aliphatic and/or aromatic dicarboxylic acids and an amine component consisting of one or more aliphatic diamines with a number of carbon atoms equal to or greater than 4 and at least one of one or more cycloaliphatic or heterocyclic diamines and optionally one or more polyoxyalkylene-diamines show excellent adhesion to untreated poly-.alpha.-olefin substrates. This avoids expensive purification of the polymeric fatty acid by distillation and also avoids the use of additional polymers for compounding hotmelt adhesives suitable for poly- .alpha.-olefin bonding.

L'invention concerne des compositions adhésives thermofusibles à base d'acides gras polymères bruts, éventuellement d'acides dicarboxyliques aliphatiques et/ou aromatiques, et d'un constituant aminé renfermant une ou plusieurs diamines aliphatiques avec une quantité d'atomes de carbone supérieure ou égale à 4, au moins une diamine cycloaliphatique ou hétérocyclique, et éventuellement une ou plusieurs diamines de polyoxyalkylène. Ces compositions présentent une excellente adhérence à des substrats poly-alpha-oléfiniques non traités. Cette invention évite donc d'avoir à entreprendre une purification coûteuse des acides gras polymères par distillation, et d'utiliser d'autres polymères afin de composer des adhésifs thermofusibles pouvant être utilisés dans une liaison poly-alpha-oléfinique.

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