Hotmelt bonding process

C - Chemistry – Metallurgy – 09 – J

Patent

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154/107.4

C09J 5/06 (2006.01) B32B 7/12 (2006.01) C08G 18/10 (2006.01) C08G 18/42 (2006.01) C09J 175/06 (2006.01)

Patent

CA 2038087

Mo3537 LeA 27,750 HOTMELT BONDING PROCESS ABSTRACT OF THE DISCLOSURE The invention relates to a process for bonding surfaces with isocyanate-containing prepolymers having an isocyanate group content of less than 1.8% by weight, based on the prepolymer, and an average molecular weight MWn of at least 4,500 in which (a) the prepolymers are prepared by the reaction of (i) polyester diols prepared from dodecanedioic acid and even-numbered alkane diols containing at least 6 carbon atoms and (ii) diisocyanates; (b) the prepolymer is applied as a hotmelt adhesive at a temperature of 80 to 160°C by spin- spraying onto at least one surface to be bonded; and (c) the treated surface is brought into intimate contact with a second surface to be bonded. Mo3537

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