Housing arrangement

Details Housing arrangement Housing arrangement

H - Electricity

05

K

347/8

H05K 5/04 (2006.01)

Patent

CA 2039973

In order to eliminate complex sheet forming operations, to provide an effective heat sink and to shield against radio frequency interference and electromagnetic induction effects, the housing arrangement has two assemblies which each comprise, inter alia, a die casting made of zinc or other material having equivalent radio frequency interference and electromagnetic induction shielding properties. A main logic circuit board is shielded by the two die castings when they are assembled together.

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