Housing arrangement for a laser module

Details Housing arrangement for a laser module Housing arrangement for a laser module

G - Physics

02

B

G02B 6/42 (2006.01) H01S 5/022 (2006.01) H01S 5/00 (2006.01) H01S 5/042 (2006.01) H01S 5/18 (2006.01)

Patent

CA 2333597

The inventive housing arrangement for a laser module comprises a hermetically sealed module housing (26) which contains the laser module (30) and which has at least one outlet wall segment (28) which is permeable to laser light. A support plate (27) which either forms the floor of the module housing or supports a floor of the module housing, and a device (22) for connecting a light guide (23) are also provided. The support plate (27) comprises an HF- printed conductor support consisting of a dielectric material. An HF printed conductor section is provided for electrically HF-contacting the laser module (30), said HF printed conductor path being guided on the HF-printed conductor support.

Un ensemble boîtier destiné à un module laser comporte un boîtier de module (26) hermétique qui contient le module laser (30) et présente au moins une section de paroi de sortie (28) perméable à la lumière laser. L'ensemble boîtier comprend également une plaque de support (27) qui forme le fond du boîtier de module ou bien porte le fond du boîtier de module, et un système (22) permettant le couplage d'une fibre optique (23). La plaque de support (27) comprend un support de tracés conducteurs HF constitué d'un matériau diélectrique. Pour la mise en contact électrique HF du module laser (30), une section de tracés conducteurs HF passe sur le support de tracés conducteurs HF.

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