Housing assembly for an electronic device

Details Housing assembly for an electronic device Housing assembly for an electronic device

H - Electricity

01

L

H01L 21/56 (2006.01)

Patent

CA 2404032

The invention relates to a housing assembly for an electronic component (1) and to a method for packaging an electronic component, said housing assembly being provided with at least one electronic component (2) to the packaged, an outer support (3) and a housing frame (4). An epoxide resin that has a capillary effect is filled into the assembled housing assembly via a feed opening (7) and closes the cavities between the semiconductor chip and the housing frame by virtue of said capillary effect.

La présente invention concerne un ensemble boîtier destiné à un composant électronique (1), et un procédé permettant de mettre sous boîtier un composant électronique, l'ensemble boîtier présentant au moins un composant électronique à mettre sous boîtier (2), un support extérieur (3) et une armature de boîtier (4). Une résine époxyde à action capillaire est injectée par une ouverture de remplissage (7) à l'intérieur de l'ensemble boîtier assemblé, et referme, grâce à son action capillaire, l'espace intermédiaire séparant la puce à semi-conducteur et de l'armature de boîtier.

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