Housing for a semiconducteur unit

Details Housing for a semiconducteur unit Housing for a semiconducteur unit

H - Electricity

01

L

356/110

H01L 23/02 (2006.01) H01L 23/31 (2006.01) H01L 23/367 (2006.01) H01L 23/433 (2006.01) H01L 23/48 (2006.01) H01L 23/495 (2006.01) H05K 7/20 (2006.01)

Patent

CA 1041222

ABSTRACT C A N A D A A semiconductor arrangement is described including a housing for a semiconductor unit which includes a metal cooling body which also serves as a base plate of the housing, the remainder of the housing being a synthetic resin bead encasing the semiconductor unit. Electrical insulation between the supply lines into the housing and the base plate is effected by means of a synthetic resin film. The arrangement is suitable for the installation of semiconductor components or integrated circuits into circuit boards or layer circuits.

234514

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