Housing shell for an electronic device

Details Housing shell for an electronic device Housing shell for an electronic device

C - Chemistry, Metallurgy

08

L

C08L 77/00 (2006.01) C08K 5/00 (2006.01) C08K 5/3492 (2006.01)

Patent

CA 2531771

The invention relates to a housing shell for an electronic device. Said housing shell is produced from a heat-resistant, flame-resistant, thermoplastic material in an injection molding method. The thermoplastic material used is a halogen-free flame-resistant polyamide-based plastic.

L'invention concerne une coque-boîtier d'un appareil électronique. Cette coque-boîtier est réalisée dans une matière thermoplastique à l'épreuve des flammes et résistante aux températures élevées selon un procédé de moulage par injection. Cette matière thermoplastique est un plastique à base de polyamide à l'épreuve des flammes et exempte d'halogène.

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