Housing structure for accommodating electronics apparatus

H - Electricity – 05 – F

Patent

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H05F 3/02 (2006.01) H05K 9/00 (2006.01)

Patent

CA 2053145

A box-like housing for an electronics apparatus is provided having superior effects for preventing problems caused by electrostatic discharge (ESD). The wall of the housing is formed by a sandwiched plate consisting of the innermost layer of high electro-conductive material such as a steel plate, the middle layer of electro-insulating material such as plastic, and the outermost layer of low electro-conductive material having much higher resistance compared with the innermost layer such as a carbon-containing paint coating. The innermost layer and the outermost layer are frame-grounded through a common earth line.

ogement en forme de boîte destiné à un appareillage électronique doté de caractéristiques supérieures en matière de prévention des problèmes causés par les décharges électrostatiques. La paroi du logement est formée par une plaque en sandwich comprenant une couche intérieure faite d'un matériau fortement conducteur comme une plaque d'acier; la couche médiane est faite d'un matériau isolant comme le plastique et la couche extérieure est constituée d'un matériau faiblement conducteur ayant une résistance beaucoup plus élevée comparativement à celle de la couche intérieure, par exemple un enduit au carbone. La couche intérieure et la couche extérieure sont mises à la terre par le bâti à l'aide d'un fil de terre commun.

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