Housings for circuit cards

Details Housings for circuit cards Housings for circuit cards

H - Electricity

05

K

H05K 7/14 (2006.01) H05K 5/06 (2006.01) H05K 7/20 (2006.01)

Patent

CA 2429774

A housing for circuit cards is provided. The housing has a shell. A thermally conductive liner integral with the shell lines an interior of the shell. A protrusion of the liner extends through the shell and contacts the shell to form a pressure seal between the liner and the shell. A heat sink is disposed on an exterior surface of the shell and is thermally coupled to the protrusion of the liner. A case is disposed within the liner and is thermally coupled to the liner. The case is adapted to receive a plurality of circuit cards so that the plurality of circuit cards is thermally coupled to the case.

Logement pour cartes de circuits imprimés. Le logement comporte une coque et un revêtement conducteur thermique solidaire de la coque en recouvre l'intérieur. Une saillie du revêtement se prolonge dans la coque et entre en contact avec elle de façon à former un joint d'étanchéité entre le revêtement et la coque. Un dissipateur thermique est fixé à la surface extérieure de la coque et est en contact thermique avec la saillie du revêtement. Un boîtier est inséré dans le revêtement et est en contact thermique avec lui. Le boîtier est conçu pour contenir plusieurs cartes de circuits imprimés afin que les cartes et le boîtier soient en contact thermique.

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