Hybrid and multi-layer circuitry

Details Hybrid and multi-layer circuitry Hybrid and multi-layer circuitry

H - Electricity

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H01L 21/48 (2006.01) H01C 17/07 (2006.01) H01L 23/15 (2006.01) H01L 23/52 (2006.01) H01L 23/538 (2006.01) H01L 25/16 (2006.01) H05K 1/03 (2006.01) H05K 3/38 (2006.01) H05K 1/16 (2006.01)

Patent

CA 1253628

16096-MB ABSTRACT The present invention is directed to the process of forming a multi-layer or hybrid circuit assembly. The assembly includes at least one ceramic substrate having a deoxidized or oxygen free copper alloy foil bonded thereto by a bonding glass. The copper alloy foil may be a circuit to which a resistive metal alloy tape can be bonded so as to provide a path of precise resistance. Also, layers of foil may be glass bonded to a substrate and stacked to form multi-layer circuits.

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