Hybrid circuit working under high voltage

Details Hybrid circuit working under high voltage Hybrid circuit working under high voltage

H - Electricity

05

K

356/9

H05K 1/18 (2006.01) H01L 23/24 (2006.01) H01L 25/16 (2006.01)

Patent

CA 2018847

12 ABSTRACT OF THE DISCLOSURE The disclosure concerns hybrid circuits working under high voltage: these are most often power circuits. A power hybrid circuit includes at least one chip carrier protected by a package. This chip carrier is a substrate to which at least one component, surrounded by contact-making metallizations, is brazed. To prevent voltage breakdown, the chip carrier is protected locally by two resins: there is an external ring made of viscous resin, into which a coating of resin, which is fluid before polymerization, is poured. The interconnections not protected by a resin may he covered with an insulator by silk-screen process. The disclosed device can be applied to power circuits, made up of several chip carrier brazed into a package.

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