Hybrid interconnect lead frame for thermal ink jet printhead...

Details Hybrid interconnect lead frame for thermal ink jet printhead... Hybrid interconnect lead frame for thermal ink jet printhead...

B - Operations, Transporting

41

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26/200, 101/96.0

B41J 2/07 (2006.01) B41J 2/14 (2006.01) B41J 2/16 (2006.01) B41J 29/00 (2006.01) H05K 3/40 (2006.01) H05K 1/09 (2006.01)

Patent

CA 1295182

Abstract Disclosed herein is a method and apparatus for interconnecting a flexible (flex) circuit, printed circuit or the like to an ink jet printhead or other similar electronic device. This approach includes providing a flexible lead frame member between the flex circuit and printhead, with the lead frame member having a plurality of conductive leads or fingers extending at a predetermined angle with respect to the final plane of interconnection. During the interconnection process, these leads or fingers are spring biased through this predetermined angle to provide good compressive electrical contact between the two members interconnected by the lead frame in a single plane of interconnection.

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