Hybrid microcircuit glass-to-metal seal repair process

Details Hybrid microcircuit glass-to-metal seal repair process Hybrid microcircuit glass-to-metal seal repair process

H - Electricity

01

L

H01L 21/70 (2006.01) H01L 21/50 (2006.01) H01L 21/77 (2006.01) H01L 23/02 (2006.01) H01L 23/10 (2006.01) H05K 3/00 (2006.01)

Patent

CA 2176270

A process (20) for repairing leaking glass-to-metal seals (13) of a hybrid micro- circuit header (10). The process (20) comprises the following steps. A leaking hybrid microcircuit header (10) is delidded (21) (has its lid (18) removed). The leaking hybrid microcircuit header (10), generally with its leads (12) pointing vertically, is disposed (22) on a vacuum source (15). A vacuum is formed (23) on the hybrid microcircuitheader (10) using the vacuum source (15). A stream of helium is flowed (24) over the seals (13) to verify the presence of leaks in the seals (13) of the hybrid microcircuit header (10). A small amount of high vacuum sealant (11) is applied (25) to each of the leaking glass-to-metal seals (13) while the hybrid microcircuit header (10) is exposed to the vacuum. The vacuum draws the sealant (11) through the cracked or defective glass-to-metal seals (13). The high vacuum sealant (11) generally comprises a silicone resin having a low vapor pressure. A stream of helium is caused to flow (26) over the resealed leads (12) following application of the high vacuum sealant (11) to confirm that the hybrid microcircuit header (10) is sealed. The hybrid microcircuit header (10) is removed (27) from the vacuum source (15). The hybrid microcircuit header (10) is then cured (28) at a temperature of 15010 degrees Celsius for a minimum of 2 hours to complete the repair process (20). The lid (18) is reattached (seam sealed) following repairs. A final leak test is performed after reattachment of the lid (18).

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