Hybrid module electronics package

Details Hybrid module electronics package Hybrid module electronics package

H - Electricity

05

K

356/9

H05K 1/02 (2006.01) H01L 23/055 (2006.01) H01L 23/057 (2006.01) H01L 23/10 (2006.01) H01L 23/538 (2006.01) H01L 25/16 (2006.01) H05K 5/00 (2006.01)

Patent

CA 2017340

HYBRID MODULE ELECTRONICS PACKAGE ABSTRACT A hybrid module for packaging electronic components provides a hermetic enclosure formed by a hermetic substrate on which the components are mounted together with a hermetic lid surrounding groups of the components. A second substrate outside the hermetic enclosure is utilized for providing connections between the electronic components.

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