C - Chemistry – Metallurgy – 08 – G
Patent
C - Chemistry, Metallurgy
08
G
96/172, 402/216,
C08G 69/48 (2006.01) C08G 69/32 (2006.01) C08G 73/10 (2006.01) G03C 1/73 (2006.01) G03F 7/023 (2006.01)
Patent
CA 2018052
HYDROXY-RESINOUS BINDER MATERIALS CONTAINING BOUND AZO PHOTOSENSITIZER, METHOD AND USE Abstract of the Disclosure A photosensitive alkali-soluble, thermally-stable fluorinated hydroxy-resinous polyamide or polyimide composition comprising a resin-bound diazo sensitizer incorporated by the reaction of a diazo sensitizer compound with a predetermined percentage of the hydroxy groups of the hydroxy-resin binder material. The present compositions are self-sensitized, have adjustable alkali-solubility and provide high speed photoresist compositions for producing relief patterns having good edge definition and high thermal stability.
Hoechst Celanese Corporation
Khanna Dinesh N.
Smart & Biggar
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