I.c. chip mounting assembly and a method of manufacturing...

Details I.c. chip mounting assembly and a method of manufacturing... I.c. chip mounting assembly and a method of manufacturing...

H - Electricity

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26/112

H01L 23/28 (2006.01) H01L 21/60 (2006.01) H01L 23/495 (2006.01)

Patent

CA 1162392

9336 ABSTRACT An IC chip mounting assembly comprises a lead frame providing a heat sink (3) and leads (4, 5, 6), and a housing (2) moulded on to the lead frame and providing a cavity (7) in which the chip (11) is received, the housing (2) having a wall (9) formed on the heat sink (3) with an aperture (10) in the wall (9) to receive and locate the chip (11). The wall (9) is also formed with a number of solder wells (13) in communication with the aperture (10), which solder wells (13) receive any excess solder (12) when the chip (11) is bonded to the heat sink (3), such bonding being carried out with the use of an induction heating apparatus.

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