H - Electricity – 05 – K
Patent
H - Electricity
05
K
356/9
H05K 1/03 (2006.01) B32B 37/18 (2006.01) G06K 19/077 (2006.01) H05K 3/00 (2006.01)
Patent
CA 1219964
Abstract of the Disclosure In an IC card according to the present invention, a base sheet formed of thermoplastic material is sandwiched between a substrate sheet and a dummy sheet both formed of nonplastic material lower in thermoplasticity than the base sheet. The substrate sheet is fitted with at least one IC chip and input/output terminals electrically connected to the IC chip. First and second cover sheets formed of thermoplastic material are put individually on the outer surfaces of the substrate sheet and the dummy sheet. The cover sheet on the substrate sheet is formed with apertures through which the input/output terminals are exposed to the outside.
482711
Fukumoto Yoshikatsu
Hiranuma Shuji
Kisaka Takanori
Kishida Ko
Ohuchi Masayuki
Kabushiki Kaisha Toshiba
Ridout & Maybee Llp
Shoei Printing Company Limited
LandOfFree
Ic card and method for manufacturing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Ic card and method for manufacturing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ic card and method for manufacturing the same will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1319868