Ic carrier

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H - Electricity

01

L

356/146

H01L 23/50 (2006.01) H01L 21/00 (2006.01)

Patent

CA 2013229

ABSTRACT OF THE DISCLOSURE An IC carrier has a frame formed in such a manner as to be continuous into a generally square shape, an IC accom- modating portion formed in an internal area of the frame and adapted to accommodate an IC package therein, a supporting portion formed on the frame and adapted to support contact pieces of the IC package, and an engaging claw integrally formed on the frame and adapted to hold the IC package. The IC carrier further has a hinge portion formed on an angular portion on one of the diagonal lines of the frame and adapted to bend the frame against resiliency.

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