Ic chip packaging for reducing bond wire length

Details Ic chip packaging for reducing bond wire length Ic chip packaging for reducing bond wire length

H - Electricity

01

L

H01L 23/00 (2006.01) H01L 23/02 (2006.01) H01L 23/12 (2006.01)

Patent

CA 2390627

An integrated circuit packaging assembly for reducing the length of bond wires transmitting radio frequency signals is disclosed herein. The die is offset in the packaging to position a subset of its bond pads in close proximity to package bond pads to allow for shorter bond wires, which reduces the inductive reactance that is induced in longer wires by high frequency signals. The subset of the bond pads is used for RF transmissions, while the other bond pads are used for direct current and low frequency signals.

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