Ic-compatible parylene mems technology and its application...

Details Ic-compatible parylene mems technology and its application... Ic-compatible parylene mems technology and its application...

H - Electricity

01

L

H01L 21/00 (2006.01) B81B 3/00 (2006.01) B81C 1/00 (2006.01)

Patent

CA 2364498

A combined IC/Mems process forms the IC parts first, and then forms the MEMS parts (110). One option forms a parylene overlayer, then forms a cavity under the parylene overlayer.

L'invention concerne un procédé combiné circuit intégré/systèmes micro-électromécaniques consistant à former d'abord la partie circuit intégré, puis la partie systèmes micro-électromécaniques (110). On peut éventuellement former une couche supérieure de parylène, puis une cavité sous la couche supérieure de parylène.

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