Ic package extracting mechanism used in ic socket

Details Ic package extracting mechanism used in ic socket Ic package extracting mechanism used in ic socket

H - Electricity

01

R

339/10

H01R 33/76 (2006.01) H05K 1/00 (2006.01)

Patent

CA 1286740

ABSTRACT OF THE DISCLOSURE An IC package extracting mechanism used in an IC socket is disclosed. The socket has a socket substrate including an IC package accommodating section, and a contact for a contacting terminal or the IC package which is accommodated in the IC package accommodating section. The socket includes a seesaw lever for pushing up the IC package. The seesaw lever is formed at its one end with an IC package push-up lever portion disposed below the IC package accommodated in the IC package accommodating section and at its other end with a push-down lever portion. The IC package push-up lever portion and the push-down lever portion are able to move up and down in turn like a seesaw motion balancing on a support disposed at the center between both levers. The socket substrate is provided with push-down means for rendering a push-down force to the push-down lever portion. The push-down means pushes down the push-down lever portion to spring up the IC package push-up lever portion, so that the IC package will be pushed up.

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