Id tag package and rfid system

G - Physics – 06 – K

Patent

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Details

G06K 19/077 (2006.01) G06K 19/04 (2006.01) G06K 19/07 (2006.01)

Patent

CA 2613886

[PROBLEMS] To provide an ID tag package for RFID, which performs excellent wireless communication regardless of existence of external metal or water and is strong against stresses from the external even under severe use environment, and to provide a RFID system using such package. [MEANS FOR SOLVING PROBLEMS] In the RFID system, an ID tag package (20) has a structure, which covers an ID tag (22) for RFID and has thicknesses (L1, L2) required for reducing electromagnetic wave attenuation due to existence of at least external metal or water. The RFID system includes an elastic layer (24) which can relax stresses from the external.

Le problème à résoudre dans le cadre de cette invention est d~obtenir un boîtier d~étiquette d~identification RFID, qui permet une excellente communication sans fil en présence ou non de métal ou d~eau dans l~environnement et qui offre une bonne résistance aux contraintes externes, même dans des conditions d~utilisation extrêmes, et à obtenir un système RFID employant ce boîtier. La solution proposée consiste en un boîtier d~étiquette d~identification (20) dans le système RFID, doté d~une structure comprenant une étiquette d~identification RFID (22) ayant des épaisseurs (L1, L2) requises pour réduire l~atténuation d~onde électromagnétique due à la présence au moins de métal externe ou d~eau. Le système RFID comprend une couche élastique (24) qui peut atténuer les contraintes externes.

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