Image pick-up element assembly and image pick-up element

H - Electricity – 04 – N

Patent

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Details

H04N 1/024 (2006.01) H04N 1/04 (2006.01) H04N 5/335 (2006.01)

Patent

CA 2547376

An image pick-up element 1 is mounted on an element mounting part 7 formed with a member whose thermal conductivity is higher than that of an element storing part 3. Inputting and outputting pins 5 for electrically connecting the image pick-up element to a control circuit board 13 for controlling the image pick-up element are provided in a direction that does not interfere with the contact part of the element mounting part 7 and a heat absorbing mechanism 8. Thus, the thermal conductivity of the image pick-up element and the heat absorbing mechanism can be improved and the area of a heat absorbing part can be increased. As a result, the cooling capability of the element is increased so that the image pick-up element can be driven under a condition at higher speed than usual.

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