Imidazole compound-containing hardening agent composition,...

Details Imidazole compound-containing hardening agent composition,... Imidazole compound-containing hardening agent composition,...

C - Chemistry, Metallurgy

08

L

400/110, 402/270

C08L 63/00 (2006.01) C08G 59/50 (2006.01) C08G 59/56 (2006.01) C08G 59/68 (2006.01) C08K 5/34 (2006.01) C09J 163/00 (2006.01)

Patent

CA 2026994

ABSTRACT OF THE DISCLOSURE Disclosed is a hardening agent composition for epoxy resins, which comprises a low-reactive hardening agent, an imidazole compound and a zeolite, wherein the imidazole compound is substituted on the imidazole nucleus by at least one of (a) and (b): (a) an alkyl group having 2 or more carbon atoms and a polar group, and (b) an alkenyl group. In another aspect of the invention the hardening agent composition is combined with an epoxy resin to form a thermosetting epoxy resin composition, capable of hardening under heat to give a hardened product having a remarkably elevated adhesion strength. A method for forming the hardening agent composition is also disclosed.

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