Imide prepolymers, cured products, method for making,...

Details Imide prepolymers, cured products, method for making,... Imide prepolymers, cured products, method for making,...

C - Chemistry, Metallurgy

08

G

154/103, 402/216

C08G 73/10 (2006.01) B32B 27/04 (2006.01) C07D 207/452 (2006.01) C08G 73/12 (2006.01) C08J 5/24 (2006.01) H05K 1/03 (2006.01)

Patent

CA 2013018

-24- ABSTRACT OF THE DISCLOSURE A novel imide prepolymer comprising specific bismaleimide and diamine components in a specific molar ratio cures into a product having improved dielectric properties, heat resistance, and bond strength. An encapsulating composition for semiconductor packages is obtained therefrom. The prepolymer is used to form prepregs from which laminates useful as multilayer printed circuit boards are manufactured.

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