Immersion cooled high density electronic assembly

Details Immersion cooled high density electronic assembly Immersion cooled high density electronic assembly

H - Electricity

05

K

347/4

H05K 7/20 (2006.01)

Patent

CA 1212173

Abstract of the Disclosure An immersion cooling system for high density electronic assemblies such as computers includes a container holding an inert cooling liquid, and stacks of circuit modules arranged in a generally radial pattern within the container. Coolant supply columns and coolant removal columns alternate between adjacent stacks around the pat- tern. The coolant supply columns include distribution mani- folds which distribute incoming coolant at all levels to provide a flow of coolant to all circuit modules. The flow passes between adjacent boards of the modules and preferably along flow channels formed by the circuit chips aligned in rows. After passing across the circuit modules the heated coolant rises in coolant removal columns and flows over stand pipes for removal from the container, and a pump and heat exchanger retools and recirculates the coolant. Pump up and pump down systems are also provided for withdrawing the coolant to a reservoir for servicing the circuitry.

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