Immersion cooling coolant and electronic device using this...

Details Immersion cooling coolant and electronic device using this... Immersion cooling coolant and electronic device using this...

C - Chemistry, Metallurgy

09

K

C09K 5/04 (2006.01) H05K 7/20 (2006.01)

Patent

CA 2042260

IMMERSION COOLING COOLANT AND ELECTRONIC DEVICE USING THIS COOLING ABSTRACT OF THE DISCLOSURE A coolant for cooling a semiconductor element by direct immersion, cooling, which has an improved cooling capability, is disclosed. The coolant comprises a low boiling point fluorocarbon having a boiling point of 30°C to 100°C and a high boiling point fluorocarbon having a boiling point higher than that of the low boiling point fluorocarbon by at least 100°C; an amount of the high boiling point fluorocarbon being less than 20% by volume, based on the volume of the low boiling point fluorocarbon.

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