Immersion plating of tin-lead alloys

Details Immersion plating of tin-lead alloys Immersion plating of tin-lead alloys

C - Chemistry, Metallurgy

23

C

6/4, 117/77

C23C 18/48 (2006.01) H05K 3/24 (2006.01) H05K 3/34 (2006.01)

Patent

CA 1049704

ABSTRACT A method of immersion plating a tin-lead alloy onto a metal substrate, especially a copper or copper-containing substrate, comprises immersing the substrate in a bath containing a tin salt, preferably stannous chloride, and a plumbous salt, preferably plumbous chloride, and a sulphur- containing complexing agent for the tin and the lead, preferably thiourea or a thiourea derivative. The plumbous salt should be present in an amount sufficient to provide from 0.5 grams of lead per litre up to the limit of solubility of the salt. The advantages are quicker deposition without whisker growth and the ability to plate alloys containing up to 95% lead.

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