C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/4603
C08L 77/00 (2006.01) C08L 23/00 (2006.01)
Patent
CA 2008497
- 23 - Abstract of the Disclosure: Thermoplastic molding com- positions are composed of (A) from 30 to 96 % by weight of a semicrystalline nylon-6.6 or of a semicrystalline partly aromatic copolyamide of .alpha.1) from 40 to 90 % by weight of an equimolar mixture of terephthalic acid and hexamethylene- diamine, .alpha.2) from 0 to 50 % by weight of .epsilon.-caprolactam and .alpha.3) from 0 to 60% by weight of an equimolar mixture of adipic acid and hexamethylene- diamine, and also .alpha.4) from 0 to 15 % by weight of a further poly- amide-forming monomer, the proportion of components .alpha.2) and/or .alpha.3) being not less than 10 % by weight and the copolyamide having a triamine content of less than 0.5 % by weight, (B) from 2 to 50 % by weight of a semicrystalline polyamide different from (A), (C) from 2 to 25 % by weight of a nonionomeric elasto- meric polymer, and (D) from 0 to 50 % by weight of a fibrous or particulate filler or a mixture thereof.
Goetz Walter
Gutsche Herbert
Plachetta Christoph
Wolf Uwe
Basf Aktiengesellschaft
Goetz Walter
Gutsche Herbert
Plachetta Christoph
Robic Robic & Associes/associates
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