C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/4603
C08L 77/00 (2006.01) C08L 25/00 (2006.01) C08L 65/00 (2006.01) C08L 71/04 (1985.01)
Patent
CA 1262587
23443-321D ABSTRACT OF THE DISCLOSURE A thermosplastic resin composition, which comprises (a) from 5 to 85 parts by weight of a melted or remelted preliminary molding compound consisting of from 60 to 98 parts by weight of polyphenylene ethers, 40 to 2 parts by weight of polyoctylenes, from 0.1 to 5 parts by weight of maleic anhydride and from 0.1 to 5 parts by weight of a further acid derivative which has a melting point below 100°C and which is selected from the group consisting of an unsaturated mono- or dicarboxylic acid having up to 14 carbon atoms, an anhydride thereof, which excludes maleic anhydride, and an ester of mono- or dicarboxylic acid with an alcohol of up to 6 carbon atoms; and (b) from 95 to 15 parts by weight of an aliphatic homopolyamide or a copolyamide containing a preponderant amount of aliphatic monomer units.
531068
Bartmann Martin
Burzin Klaus
Droscher Michael
Feinauer Roland
Gerth Christian
Bartmann Martin
Burzin Klaus
Droscher Michael
Feinauer Roland
Fetherstonhaugh & Co.
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