Impregnating, casting and coating compositions for...

H - Electricity – 01 – B

Patent

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Details

H01B 3/42 (2006.01) C08L 67/06 (2006.01) C08L 67/07 (2006.01) C09D 167/06 (2006.01) C09D 167/07 (2006.01)

Patent

CA 2283706

The invention concerns the use of a resin compound (A) as impregnating, casting and coating compounds for electrotechnical and/or electronic components and for carrier materials for plane insulating materials. The resin compound (A) contains: A1) at least one unsaturated polyester resin; A2) at least one vinylether with a viscosity of less than 4000 mPa.s at 25 ~C; A3) optionally at least one further polymer and/or oligomer; A4) optionally at least one curing accelerator; A5) optionally at least one ethylenically unsaturated reactive thinner; and A6) optionally further conventional additives. The invention further concerns coating compounds which cure with low emission and are suitable for this purpose.

L'invention a pour objet l'utilisation comme produits d'imprégnation, de moulage et de revêtement pour des composants électrotechniques et/ou électroniques, ainsi que pour des matériaux supports pour matières isolantes planes, d'une composition de résine (A) renfermant A1) au moins une résine polyester insaturée, A2) au moins un éther vinylique de viscosité inférieure à 4000 mPa.s à 25 ·C, A3) éventuellement, au moins un autre polymère et/ou oligomère, A4) éventuellement, au moins un accélérateur de durcissement, A5) éventuellement au moins un diluant réactif éthyléniquement insaturé, et A6) éventuellement, d'autres adjuvants courants. L'invention concerne en outre des produits de revêtement durcissables, à faible émission, appropriés pour une telle utilisation.

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