H - Electricity – 01 – L
Patent
H - Electricity
01
L
H01L 21/3105 (2006.01) B44B 5/02 (2006.01) G03F 7/00 (2006.01)
Patent
CA 2384463
An apparatus for planarizing or patterning a dielectric film on a substrate is provided. The apparatus includes a press for applying contact pressure to an operably connected compression tool. The compression tool has a working face that is planar or patterned. A controller for regulating the position, timing and force applied by the compression tool to the dielectric film is also provided. There is also provided a support, with an optional workpiece holder for supporting the substrate and dielectric film during contact with the compression tool. Methods of using the apparatus, as well as planarized and/or patterned dielectric films are also provided.
L'invention porte sur un appareil d'aplanissement de films diélectriques formés sur des substrat et de formation de motifs sur ces mêmes films. Ledit appareil comprend: une presse appliquant une pression de contact sur un outil de compression lui étant relié présentant une face de travail plane ou à motifs; un contrôleur réglant la position, le moment et l'intensité de la force appliquée par l'outil de compression sur le film diélectrique; et un support facultativement muni d'un préhenseur saisissant le substrat et le film diélectrique lorsqu'ils entrent en contact avec l'outil de compression. L'invention porte également sur les modes d'utilisation de l'appareil et sur les films diélectriques aplanis ou dessinés ainsi obtenus.
Drage James S.
Endish Denis H.
Levert Joseph A.
Towery Daniel Lynne
Alliedsignal Inc.
Gowling Lafleur Henderson Llp
Honeywell International Inc.
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