Improved electroplating system and process

Details Improved electroplating system and process Improved electroplating system and process

C - Chemistry, Metallurgy

25

D

C25D 5/04 (2006.01) C25D 17/20 (2006.01)

Patent

CA 2226991

This invention relates to a system and process for electroplating that has plating drums whereby the plating drums are filled, and emptied of parts at each individual plating cell and the parts are cleansed by spraying, wiping and/or drying and whereby only cleansed parts are transported from plating cell to plating cell. This results in less contamination and higher efficiencies in plating.

La présente invention a pour objet un système et un procédé d'électrodéposition comprenant des tambours d'électrodéposition qui sont remplis de pièces et vidés à chaque cellule individuelle d'électrodéposition et les pièces sont nettoyées par pulvérisation, essuyage et/ou séchage. Seulement les pièces nettoyées sont transportées d'une cellule d'électrodéposition à une autre cellule d'électrodéposition. Il en résulte une contamination moins importante et un meilleur rendement de l'électrodéposition.

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