Improved method for making printed circuits

H - Electricity – 05 – K

Patent

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H05K 1/16 (2006.01) H05K 3/00 (2006.01) H05K 3/12 (2006.01) H05K 3/46 (2006.01) H05K 1/09 (2006.01) H05K 3/24 (2006.01)

Patent

CA 2006585

1523d ABSTRACT OF THE DISCLOSURE Printed circuits are produced by screen printing or the like to deposit conductors, resistors, capacitors and insulators. Crossover connections are made by covering the conducting portions to be crossed with an insulating material that serves as a base for a printed crossing conductor. Exposed conductors, as for keyboards and compression connections, are protected from the development of high-resistance corrosion products by printing or overprinting them with an ink that deposits a carbon layer. The method permits the use of rigid printed-circuit boards having crossed connections without requiring the use of a two-sided board. The equivalent of multilayer boards can be achieved by printing repeated layers of conductors. components and insulators on the same side of the board, or by printing on two sides of a board. Interconnection between adjacent layers can be made as a part of the printing process. Resistors can be printed by screening or otherwise depositing a controlled amount of a resistive ink. Capacitors can be produced by printing conductive layers separated by insulating layers. The process may produce printed-circuit boards containing resistors and capacitors without the necessity for inserting and wave-soldering components. If such a board is to contain components in addition to those printed by the process of the present invention, a printed carbon layer can be used as a solder resist to protect printed conductors during the wave-soldering process, and to protect exposed contacts, as for keyboards, during wave-soldering and in use. The process also permits the printing of a conducting layer as a shield against radio-frequency interference or as a ground place to provide electrical isolation of portions of a circuit from each other. A method of making a printed circuit board comprises applying a first and second coating in a desired pattern to a substrate, the substrate (12) being disposed in a different relationship to coating apparatus used in applying a second coating fro the relationship in which it is disposed in applying the first coating. Preferably a number of identical boards are printed on a substrate (12) from which they are subsequently separated. The individual boards are positioned such that the same pattern may be applied when the substrate (12) is presented to coating means in any of a number of orientations each separated from the next by a fixed angle of rotation about an axis (A) at right angles to the substrate (12), the first coating being applied in one such orientation and the second after the screen and substrate respectively have been rotated in opposite directions, (C, B) each through 90°.

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