Improved method for micro-roughening treatment of copper and...

Details Improved method for micro-roughening treatment of copper and... Improved method for micro-roughening treatment of copper and...

H - Electricity

05

K

H05K 3/38 (2006.01)

Patent

CA 2536836

Process to improve adhesion of dielectric materials to a metal layer, including providing an unpatterned metal layer having a first major surface; micro-roughening the first major surface to form a micro-roughened surface; and etching the metal layer to form a circuit pattern in the metal layer, in which the micro-roughening is carried out prior to the etching.

L'invention concerne un procédé destiné à améliorer l'adhésion de matériaux diélectriques à une couche de métal et consistant à utiliser une couche de métal vierge possédant une première surface principale, à micro-rugosifier la première surface principale de sorte à former une surface micro-rugosifiée, puis à graver la couche de métal de manière à former un motif de circuit dans la couche de métal, la micro-rugosification étant réalisée avant la gravure.

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