C - Chemistry – Metallurgy – 07 – C
Patent
C - Chemistry, Metallurgy
07
C
C07C 247/18 (2006.01) B41C 1/10 (2006.01) G03F 7/008 (2006.01) G03F 7/20 (2006.01)
Patent
CA 2207864
Printing plates having a photoresist layer thereon that can be exposed by a computer controller laser have improved sensitivity and do not require a photomask step. We have found photoresists that include a film forming polymer, an organo azide and a photosensitive dye that absorbs light at the frequency of the patterning laser and converts it to heat energy. The heat energy in turn elevates the temperature of the organo azide above its dissociation temperature, destroying the azide in areas exposed to the light source, and solubilizing those regions. A flood exposure with ultraviolet light hardens the unexposed resist, improving its resistance to etch solvents. Thus a flood exposure with ultraviolet light can be performed prior to or after pattern exposure, to harden the resist.
Holman Bruce III
Mulvey Merlin L.
Sharkozy Larry
Zaloom Jeffrey G.
Zhou Peiguang
Kirby Eades Gale Baker
Printing Developments Inc.
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