Improved plasma spraying

Details Improved plasma spraying Improved plasma spraying

C - Chemistry, Metallurgy

23

C

C23C 4/12 (2006.01) B05B 7/22 (2006.01) H05H 1/34 (2006.01)

Patent

CA 2237116

An apparatus 1 for the plasma spraying of a substrate 2 comprises a reaction chamber 3 at one end of which is located a plasma torch. A plasma forming gas isdelivered under pressure to the torch such that a plasma jet is produced which extends along the length of the reaction chamber 3. An inlet port 8 is provided in the torch for the passage therethrough of a powder material and inlet ports 4 are provided in the reaction chamber 3 for injecting a reactive gas such as methane into the plasma jet.

La présente invention a pour objet un dispositif pour le traitement de substrats (2) par projection plasma; le dispositif en question comporte une chambre de réaction (3) à une extrémité de laquelle se trouve un chalumeau à plasma. Un gaz plasmagène est acheminé sous pression vers le chalumeau à plasma pour la production d'un jet de plasma traversant toute la longueur de la chambre de réaction (3). Un orifice d'admission (8) est pratiqué dans le chalumeau pour permettre le passage de matières pulvérulentes et des orifices d'admission (4) sont pratiqués dans la chambre de réaction (3) pour l'injection d'un gaz de réaction, tel du méthane, dans le jet de plasma.

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