Improved plasma transferred wire arc thermal spray apparatus...

B - Operations – Transporting – 05 – B

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Details

B05B 7/22 (2006.01) B05B 7/18 (2006.01) B05B 13/06 (2006.01) B23K 9/00 (2006.01) B23K 10/02 (2006.01)

Patent

CA 2280019

A plasma transferred wire arc thermal spray apparatus is described for applying a coating to a surface. The apparatus comprises a cathode (51) having a first negative electrical potential, a nozzle (50) generally surrounding a free end of said cathode (51) in spaced relation having a restricted orifice (55) opposite said cathode free end, said nozzle (50) having a second positive electrical potential, a source of plasma gas directing plasma gas into said nozzle (50) surrounding said cathode (51) and exiting said restricted nozzle orifice (55), and a wire feed (58a, 58b) continuously directing a free end of wire feedstock (56) opposite said restricted nozzle orifice (55) and said wire feedstock (56) having the same second positive electrical potential as said nozzle (50), said apparatus thereby establishing a plasma transferred-arc between said wire feedstock free end and said cathode (51) melting said wire feedstock free end and said plasma gas exiting said restricted nozzle orifice (55) atomising melted feedstock and propelling atomised melted wire feedstock toward said surface, thereby coating said surface. A method of coating a surface with a metallic coating is also disclosed.

Appareil de métallisation à chaud à plasma à arc transféré permettant d'appliquer un revêtement sur une surface. Ledit appareil comporte une cathode (51) dotée d'un premier potentiel électrique négatif, une tuyère (50) entourant une extrémité libre de ladite cathode (51) de manière à laisser un certain espace et dotée d'un orifice resserré (55) situé en face de l'extrémité libre de la cathode, ladite tuyère (50) étant pourvue d'un second potentiel électrique positif, une source de gaz plasma dirigeant un gaz plasma dans ladite tuyère (50) entourant la cathode (51), le gaz sortant par l'orifice (55) de tuyère resserré, et une alimentation (58a, 58b) en fil métallique qui dirige en continu une extrémité libre du fil métallique (56) en face de l'orifice (55) de tuyère resserré, ledit fil métallique (56) ayant le même second potentiel électrique positif que la tuyère (50). Ledit appareil établit ainsi un arc transféré à plasma entre l'extrémité libre du fil métallique et la cathode (51), cette dernière fait fondre l'extrémité libre du fil métallique et le gaz plasma qui sort de l'orifice (55) resserré de tuyère atomise le fil fondu et propulse le métal fondu atomisé sur la surface, cette dernière se trouvant ainsi recouverte. Un procédé permettant de déposer un revêtement métallique sur une surface est également décrit.

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