B - Operations – Transporting – 29 – B
Patent
B - Operations, Transporting
29
B
B29B 11/08 (2006.01) B29C 45/00 (2006.01) B29C 45/46 (2006.01)
Patent
CA 2208355
Preform useful for encapsulating semiconductors and other electric or electronic devices are prepared by a process which comprises warming thermoset resin to form a melt, injecting it into a mold, and cooling to form a solidified molding, all without substantially curing the thermoset resin.
La présente invention concerne un procédé de fabrication de préformes destinées à l'encapsulation de semi-conducteurs ou d'autres dispositifs électriques ou électroniques. Ce procédé consiste à chauffer une résine thermodurcie pour former un bain, à injecter ce dernier à l'intérieur d'un moule, et à refroidir en vue de l'obtention d'un moulage solidifié, tout ceci sans pratiquement traiter la résine thermodurcie.
Chin Neep Hing
Chua Manuel Alameda Jr.
Karunaratne Palitha Mahendra S.
Rounds Nicholas Andrew
Srinivasan Visveswaran
Amoco Corporation
Cookson Singapore Pte Ltd
Gowling Lafleur Henderson Llp
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