C - Chemistry – Metallurgy – 23 – C
Patent
C - Chemistry, Metallurgy
23
C
C23C 18/44 (2006.01) C23C 18/16 (2006.01) C23C 18/18 (2006.01)
Patent
CA 2539656
An improved method for plating an organic substrate with silver is disclosed. Improved plating is achieved in part through the use of Na4EDTA, which facilitates improved grain formation and recovery of silver from waste material. Articles prepared using the method of the invention are also disclosed.
L'invention porte sur un procédé amélioré de plaquage d'argent sur un substrat organique utilisant en partie du Na¿4?EDTA qui facilite la formation de grains et la récupération de l'argent présent dans des déchets. L'invention porte également sur des articles réalisés à l'aide dudit procédé.
Chandra Satish N.
Furey Joel M.
Mcnally William F.
Naik Vinesh
Goudreau Gage Dubuc
Noble Fiber Technologies
Noble Fiber Technologies Llc
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