Improved stencil or mask for applying solder to circuit...

B - Operations – Transporting – 05 – C

Patent

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Details

B05C 17/06 (2006.01) B41F 15/36 (2006.01) H05K 3/34 (2006.01)

Patent

CA 2137076

The present invention relates to a stencil (3) or mask having opposite side regions (6, 7, 6', 7') adapted or modified by being apertured or of reduced thickness so as to be more flexible than the main body of the sheet from which the mask is formed and so as to enable the opposite side regions to be bent along said regions without kinking or other deformation during tensioning. The invention also relates to apparatus for enabling stencilling processes to be performed, comprising a stencil (3), and support therefor which are detachably interconnectable and such that the stencil is flexed or bent so that the interconection means do not project beneath the lowermost planar surface of the stencil in its operative position.

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