G - Physics – 01 – N
Patent
G - Physics
01
N
G01N 3/08 (2006.01) G01N 33/00 (2006.01)
Patent
CA 2372551
The present invention relates to methods and structures for facilitating the removal of integrated circuit devices, microelectronic devices or die from substrates and/or for testing the integrity of the bonding between such devices and the substrate, and preferably where the integrated circuit device is a flip chip. The invention provides. in one embodiment a microelectronic device or die having a ball and stud connector attached to a surface of the device opposite to the surface which is intended to be connected to a substrate. In other embodiments, the invention provides for methods and apparatus for removing one or more die attached to a substrate, or assessing the integrity of the bond between each die and the substrate. Each die having a ball and stud connector attached thereto is positioned or secured in a holder. A mechanism clamped to the ball and stud connector applies a tensile force to the die such that the tensile force is exerted essentially perpendicular to the surface of the substrate to which the die is attached and this results from the interaction of the mechanism and the ball and stud connector. This results in removal of the die from the substrate without significant damage to the die or the substrate or for assessing the integrity of the bond between the die and the substrate by attaching a ball and stud connector to the die. No application of heat is required.
Gaouette Rejean M.
Henry Jean-Paul
Landreville Jean-Luc L.
Pharand Sylvain
Barrett B.p.
Ibm Canada Limited - Ibm Canada Limitee
Pharand Sylvain
LandOfFree
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