Improvement in injection molding apparatus

Details Improvement in injection molding apparatus Improvement in injection molding apparatus

B - Operations, Transporting

29

C

B29C 45/68 (2006.01) B29C 31/00 (2006.01) B29C 33/72 (2006.01) B29C 45/02 (2006.01) B29C 45/06 (2006.01) B29C 45/14 (2006.01) B29C 45/17 (2006.01) B29C 45/66 (2006.01) B30B 15/00 (2006.01) H01L 21/00 (2006.01) H01L 21/56 (2006.01)

Patent

CA 2252562

An integrated circuit encapsulation apparatus comprises a molding press, which has a mold defining a cavity adapted to receive an integrated circuit die and an attached leadframe for encapsulation thereof. The press is provided with an integrated mold brushing unit which has transversely rotating brushes and travels over the mold faces to remove debris. In a further refinement, a spring-loaded bearing system is provided for easy removal of the mold.

Cet appareil d'encapsulation de circuits intégrés comprend une presse de moulage comportant un moule délimitant une cavité conçue pour recevoir, afin de les encapsuler, une puce de circuit intégré et un réseau de conducteurs fixé sur celle-ci. La presse est solidairement pourvue d'une unité de brossage du moule, présentant des brosses rotatives se déplaçant selon un axe transversal et circulant au-dessus des faces du moule pour en enlever les débris. Dans un autre perfectionnement, on a monté un système de palier chargé par ressort, aux fins d'un enlèvement facile du moule.

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