Improvements in grounding and thermal dissipation for...

Details Improvements in grounding and thermal dissipation for... Improvements in grounding and thermal dissipation for...

H - Electricity

01

L

H01L 23/34 (2006.01) H01L 23/31 (2006.01) H01L 23/36 (2006.01) H01L 23/552 (2006.01)

Patent

CA 2409912

In assembling a typical microelectronic chip package for which grounding and thermal dissipation is desired, when attempting to simultaneously attach a cover to two different surfaces with two different adhesives, difficulties are typically encountered. This invention provides for a method and electronic package to overcome these difficulties. A cover has an opening which is aligned with a contact on the substrate connected to ground potential. The cover is connected to the electronic device and the ground contact.

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