Improvements in heat dissipation for electronic enclosures

H - Electricity – 05 – K

Patent

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Details

H05K 7/20 (2006.01) H04Q 1/10 (2006.01)

Patent

CA 2540154

An electronics enclosure is provided. The enclosure includes a cylindrical body, one or more modular card cages adapted to receive one or more electronic circuit cards. The one or more modular card cages including an outer frame member in direct physical and thermal contact with an inner wall of the cylindrical body, an inner frame member, one or more support members coupled between the outer frame member and the inner frame member, and a plurality of electronic device retainers adapted to couple to the modular card cage and hold each of the one or more electronic circuit cards in direct physical and thermal contact with one of the one or more support members. The support members provide an isolated heat dissipation path for heat, produced by each of the one or more electronic circuit cards, to be removed from the enclosure.

Cette invention concerne un boîtier électronique. Ce boîtier comprend un corps cylindrique, un ou plusieurs porte-cartes modulaires conçus pour recevoir une ou plusieurs cartes à circuits électroniques. Le ou les porte-cartes modulaires comprennent un élément de cadre extérieur disposé en contact physique et thermique direct avec une paroi interne du corps cylindrique, un élément de cadre intérieur, un ou plusieurs éléments de support couplés entre l'élément de cadre extérieur et l'élément de cadre intérieur, et une pluralité de fixations de dispositif électronique conçues pour être couplées au porte-cartes modulaire et pour maintenir chacune des cartes à circuits électroniques en contact physique et thermique direct avec un des éléments de support. Ces éléments de support fournissent un passage de dissipation thermique isolé permettant à la chaleur produite par chacune des cartes à circuits électroniques d'être évacuée du boîtier.

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